Advances in electronic packaging, 1992 Vol. 1, Physical design, thermal management, interconnection technology, structural analysis - proceedings of the Joint ASME/JSME Conference on Electronic Packaging

Författare
Japan Society of Mechanical Engineers American Society of Mechanical Engineers Hiroyuki Abé William T. Chen Joint ASME/JSME Conference on Electronic Packaging 1992 : Milpitas)
Genre
Konferenser, Konferenspublikation, Ej skönlitteratur
Språk
Engelska
Förlag År Ort Om boken ISBN
American Society of Mechanical Engineers Cop. 1992 USA, New York xi, 586 sidor.